大玩家彩票

News
Molex Impel was first released, high performance, high speed backplane connector system
Time:2014-10-09 17:04 Writer:admin Read:

 

  Molex company releases its backplane pins diagram configuration (Backplane Pin Map Configurator) Impel backplane connector systems are used together, the future oriented (future-proof) connector solutions provide the ability to make the system data rate and the cost of running the current for equipment manufacturers, and through Impel daughter card options for implementing migration path of ascension in the the same chassis. Key word.

  The Molex backplane connector

  Molex company releases its backplane pins diagram configuration (Backplane Pin Map Configurator) together with the use of the Impel? Backplane connector systems, the future oriented (future-proof) connector solutions provide the ability to make the system data rate and the cost of running the current for equipment manufacturers, and through Impel daughter card options for implementing migration path of ascension in the same chassis.

  Impel connector system with industry-leading low crosstalk and high density properties, and up to a 40 Gbps data rate, for the next generation of backplane interconnect solutions. Because it can meet all the key architectural requirements, including traditional, coplanar, orthogonal planar and orthogonal directly, therefore is ideal for telecommunications and data network application.

  Molex new product development manager Zach Bradford said: "as many customers in the design of multi generation system architecture, including a variety of data rate increases with time, our goal is to develop a highly flexible solution for high performance connector. Impel connector system provides occupying area and the required interface, allowing users to more convenient and cost-effective to faster data rate, without completely redesigning its architecture, or replace the existing data center hardware."

  Impel connector connected with right angle direction using traditional sub inserted to the vertical joint card, to provide the option 2 to 6 lines, to meet the requirements of price and performance. Traditional solutions to 1.90mm supports per linear inch 80 differential pair, and the traditional 3.00mm solutions to achieve four routing (quad-route) layer of PCB capacity and less. In these same configuration, realize coplanar solution can Impel connector system, support rectangular sub card connecting to right angle joints, increasing system scalability. Impel backplane connector solutions for orthogonal architecture, allowing the implementation of configuration of 3 to 6 lines, each node can from the 18 differential pair extended to 72 differential pair. The third generation design using the Impel connector system, also provides direct PCB orthogonal direction connection, so as to shorten the length of the channel system, improve the performance of signal integrity channel, support open flow design and reduce the cost of application.

  In order to help customers coarctation of the exact products required, Molex provides backplane pins map configuration, this tool is freely available from the Molex web site, guide the user to determine the backplane through a series of input parameters, and can quickly generate the backplane applications for the pin diagram, to help shorten time to market, so as to enhance the design and the overall performance of the backplane.

  About Molex Incorporated

  In addition to the connector, Molex also for many of the market with complete interconnect solutions, covering data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicles, aerospace and defense, medical and lighting. The company was founded in 1938, has 45 production plants in 17 countries around the world.

 

上一篇:没有了   下一篇:Strong demand for high-end connector
给我们留言  Message
*反馈主题:
*你的姓名:
 电子邮件:
 联系地址:
*留言内容:
(1000字内)
验 证 码:
  
Copyright 2011 Shenzhen Clip Electronic Co., Ltd. 沪ICP备05007222号 Technical Support: